Common machining processes for manufacturing semiconductor include milling, turning, and drilling. CNC milling machines, CNC lathes, and other machining equipment are utilized to machine the semiconductor's core and other components, ensuring the geometric dimensional accuracy and surface quality of the stator meet the requirements. For instance, milling can be employed to create grooves or support structures in the semiconductor, while turning can be used to produce axial holes.

Machining processes enable the precise fabrication and complex shaping of semiconductor, guaranteeing the quality and performance of the semiconductor align with the design specifications.